MAX6818EAP SSOP for CircuitModules (5pieces) The MAX6818EAP in a Shrink Small Outline Package (SSOP) is a Maxim Integrated device supplied in a compact, flowfriendly form factor. This listing includes five pieces intended for use in circuit module applications where a small, reliable component is required. Key benefits Spacesaving SSOP package enables dense PCB layouts for circuit modules. Consistent, proven Maxim Integrated device designed to meet the specifications of MAX6818EAP. Easy surfacemount handling and soldering with standard reflow processes, suitable for volume assembly. Flexible stocking option with five pieces per package, supporting prototyping, testing, and field . Maintains brandlevel reliability and performance for circuitmodule designs that specify MAX6818EAP. Key attributes Functionality: Part number MAX6818EAP; features are defined by the MAX6818EAP specification. Compatibility: Suitable for designs that specify MAX6818EAP components. Size: SSOP packaging, providing a compact footprint for dense circuitmodule applications. Material: Encapsulated in a standard SSOP plastic package suitable for surfacemount assembly. Performance: Designed to meet the electrical characteristics and behavior described in the MAX6818EAP datasheet under typical operating conditions. Use cases and applications Circuit module design and assembly: Ideal for designers implementing MAX6818EAP requirements within modular electronics where a compact SSOP device is beneficial. Prototyping and testing: Fivepiece set supports iterative testing, evaluation, and replacement during development of circuit modules. Field and stocking: Convenient to keep on hand as spare parts for circuit modules that utilize MAX6818EAP devices, enabling quick replacement and maintenance. This product maintains the integrity of the original brand, model, and packaging format, delivering a consistent component set for circuitmodule applications.